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647675

Silicon

Name: Silicon
Brand: ALDRICH

wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.5 mm

Synonym(s):

Silicon element

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About This Item

Linear Formula:

CAS Number:

7440-21-3

Molecular Weight:

28.09

NACRES:

NA.23

PubChem Substance ID:

24883416

UNSPSC Code:

12352300

MDL number:

MFCD00085311

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Properties

Quality Level

100

form

crystalline (cubic (a = 5.4037)), wafer (single side polished)

contains

boron as dopant

greener alternative product characteristics

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diam. × thickness

2 in. × 0.5 mm

bp

2355 °C (lit.)

mp

1410 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

greener alternative category

Enabling

semiconductor properties

<100>, P-type

SMILES string

[Si]

InChI

1S/Si

InChI key

XUIMIQQOPSSXEZ-UHFFFAOYSA-N

Description

General description

0 vortex defects. Etch pitch density (EPD) < 100 (cm^-2). Resistivity 10^-3- 40Ω•cm

Oxygen content: <= 1~1.8 x 10¹⁸/cm³; Carbon content: <= 5 x 10¹⁶/cm³; Boule diameter: 1~8 ″

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Application

<100> Silicon wafer may be used as a substrate for the epitaxial growth of SiC, and TiN thin films.

Packaging

1EA refers to 1 wafer and 5EA refers to 5 wafers

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Storage Class

13 - Non Combustible Solids

wgk

nwg

ppe

Eyeshields, Gloves, type N95 (US)

Regulatory Listings

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Substances Subject to be Indicated Names

ishl_indicated

Substances Subject to be Notified Names

ishl_notified

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Certificates of Analysis (COA)

Lot/Batch Number

MKAA3122

09303ME

08514JC

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Protocols

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

ネガ型フォトレジストキットの取り扱い方法

本フォトレジストキットには、リソグラフィープロセスにおける各ステップで必要な材料が含まれています。各材料は、すぐにお使いいただけるようにあらかじめ計量されており、エッチング液については、様々な基板に適切なものをお選びいただけるように、個別に販売しています。

Articles

一置換および二置換アルコキシシロキサンを使用した融解ゲルの合成

一置換および二置換アルコキシシロキサンから合成された融解ゲルは、生物医学、電子工学、光電子工学などへの応用が期待されています。

Synthesis of Melting Gels Using Mono-Substituted and Di-Substituted Alkoxysiloxanes

Hybrid organic-inorganic sol-gel materials containing silica were first called “ORMOSILs” in 1984.