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767484

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

Empirical Formula (Hill Notation):
Ni
CAS Number:
7440-02-0
Molecular Weight:
58.69
NACRES:
NA.23
PubChem Substance ID:
329767317
UNSPSC Code:
11101706
EC Number:
231-111-4
MDL number:
MFCD00011137
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assay

99.95% trace metals basis

form

solid

reaction suitability

core: nickel

resistivity

6.97 μΩ-cm, 20°C

diam. × thickness

2.00 in. × 0.25 in.

bp

2732 °C (lit.)

mp

1453 °C (lit.)

density

8.9 g/mL at 25 °C (lit.)

SMILES string

[Ni]

InChI

1S/Ni

InChI key

PXHVJJICTQNCMI-UHFFFAOYSA-N

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

pictograms

Health hazardExclamation mark
GHS08,GHS07

signalword

Danger

Hazard Classifications

Carc. 2 - Skin Sens. 1 - STOT RE 1

Storage Class

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

wgk

WGK 2

flash_point_f

Not applicable

flash_point_c

Not applicable

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